| Part number: | TEA1723AT%2FN1%2C118 |
| Description: | BU 510 - SECURITY & CONNECTIVITY |
| Manufacturer | NXP |
| Encapsulation | - |
| Quantity | 0 |
| RoHS | - |
| TYPE | DESCRIPTION |
| Supply Current-Max: | 970µA |
| Supply Voltage-Max: | 35V |
| Frequency-Max: | 53kHz |
| Topology: | Flyback |
| Duty Cycle-Min: | 72% |
| Duty Cycle-Max: | 78% |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -55°C to +150°C |
| Package Style: | SOIC-7 |
| Mounting Method: | Surface Mount |
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