| Part number: | MT4HTF3264HY-667F1 |
| Description: | MT4HTF3264HY-667F1 datasheet pdf and Memory Cards product details from Micron Technology stock available at Utmel |
| Manufacturer | Micron Technology |
| Encapsulation | - |
| Quantity | 0 |
| RoHS | YES |
| TYPE | DESCRIPTION |
| Mount | Socket |
| Surface Mount | NO |
| Number of Pins | 200 |
| Number of Terminals | 200 |
| ECCN (US) | EAR99 |
| HTS | 8542.32.00.32 |
| Module | DRAM Module |
| Module Density | 256Mbyte |
| Number of Chip per Module | 4 |
| Chip Density (bit) | 512M |
| Data Bus Width (bit) | 64 |
| Maximum Clock Rate (MHz) | 667 |
| Chip Configuration | 32Mx16 |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Typical Operating Supply Voltage (V) | 1.8 |
| Maximum Operating Supply Voltage (V) | 1.9 |
| Operating Current (mA) | 1000 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 70 |
| Supplier Temperature Grade | Commercial |
| Module Sides | Single |
| ECC Support | No |
| Number of Ranks | Single |
| Number of Chip Banks | 4 |
| CAS Latency | 5 |
| PC Type | PC2-5300 |
| SPD EEPROM Support | Yes |
| Standard Package Name | DIM |
| Supplier Package | SODIMM |
| Mounting | Socket |
| Package Height | 30(Max) |
| Package Length | 67.75(Max) |
| Package Width | 2.45(Max) |
| PCB changed | 200 |
| Lead Shape | No Lead |
| RoHS | Compliant |
| Number of Words | 33554432 words |
| Package Shape | RECTANGULAR |
| Manufacturer | Micron Technology Inc |
| Packaging | Tray |
| Part Status | Obsolete |
| Max Operating Temperature | 70 °C |
| Min Operating Temperature | 0 °C |
| Technology | CMOS |
| Terminal Position | DUAL |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.6 mm |
| Reach Compliance Code | unknown |
| Pin Count | 200 |
| JESD-30 Code | R-PDMA-N200 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.8 V |
| Number of Elements | 4 |
| Power Supplies | 1.8 V |
| Temperature Grade | COMMERCIAL |
| Max Supply Voltage | 1.9 V |
| Min Supply Voltage | 1.7 V |
| Supply Current-Max | 1.4 mA |
| Data Bus Width | 64 b |
| Organization | 32Mx64 |
| Output Characteristics | 3-STATE |
| Memory Width | 64 |
| Standby Current-Max | 0.028 A |
| Memory Density | 2147483648 bit |
| Max Frequency | 667 MHz |
| PLL | No |
| I/O Type | COMMON |
| Memory IC Type | DDR DRAM MODULE |
| Refresh Cycles | 8K |
| Self Refresh | Yes |
| Module Type | 200SODIMM |
| RoHS Status | RoHS Compliant |
| Radiation Hardening | No |
|
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