| Part number: | LND250K1-G |
| Description: | Microchip Technology Inc |
| Manufacturer | Microchip Technology Inc |
| Encapsulation | - |
| Quantity | 0 |
| RoHS | YES |
| TYPE | DESCRIPTION |
| Source Content uid: | LND250K1-G |
| Manufacturer Part Number: | LND250K1-G |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Active |
| Package Description: | TO-236AB, SOT-23, 3 PIN |
| Reach Compliance Code: | compliant |
| ECCN Code: | EAR99 |
| HTS Code: | 8542.39.00.01 |
| Manufacturer: | Microchip Technology Inc |
| Risk Rank: | 1.28 |
| Configuration: | SINGLE WITH BUILT-IN DIODE |
| DS Breakdown Voltage-Min: | 500 V |
| Drain Current-Max (ID): | 0.013 A |
| Drain-source On Resistance-Max: | 1000 Ω |
| FET Technology: | METAL-OXIDE SEMICONDUCTOR |
| Feedback Cap-Max (Crss): | 1 pF |
| JEDEC-95 Code: | TO-236AB |
| JESD-30 Code: | R-PDSO-G3 |
| JESD-609 Code: | e3 |
| Moisture Sensitivity Level: | 1 |
| Number of Elements: | 1 |
| Number of Terminals: | 3 |
| Operating Mode: | DEPLETION MODE |
| Operating Temperature-Max: | 150 °C |
| Operating Temperature-Min: | -55 °C |
| Package Body Material: | PLASTIC/EPOXY |
| Package Shape: | RECTANGULAR |
| Package Style: | SMALL OUTLINE |
| Peak Reflow Temperature (Cel): | NOT SPECIFIED |
| Polarity/Channel Type: | N-CHANNEL |
| Qualification Status: | Not Qualified |
| Surface Mount: | YES |
| Terminal Finish: | Matte Tin (Sn) - annealed |
| Terminal Form: | GULL WING |
| Terminal Position: | DUAL |
| Time@Peak Reflow Temperature-Max (s): | NOT SPECIFIED |
| Transistor Application: | SWITCHING |
| Transistor Element Material: | SILICON |
|
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