| Part number: | ADXRS646TBGZ-EP-RL |
| Description: | electromechanically excite the sensor to test proper operation of both the sensor and the signal conditioning circuits. The ADXRS646 is available in a 7 mm × 7 mm |
| Manufacturer | Analog Devices |
| Encapsulation | - |
| Quantity | 21 |
| RoHS | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | ADXRS646TBGZ-EP-RL |
| Brand Name: | Analog Devices Inc |
| Pbfree Code: | No |
| Rohs Code: | No |
| Part Life Cycle Code: | Active |
| Ihs Manufacturer: | ANALOG DEVICES INC |
| Part Package Code: | BGA |
| Package Description: | FBGA, BGA32,7X7,32 |
| Pin Count: | 32 |
| Manufacturer Package Code: | BG-32-3 |
| Reach Compliance Code: | compliant |
| ECCN Code: | 7A994 |
| HTS Code: | 8542.39.00.01 |
| Manufacturer: | Analog Devices Inc |
| Risk Rank: | 5.04 |
| Analog IC - Other Type: | ANALOG CIRCUIT |
| JESD-30 Code: | S-CBGA-B32 |
| JESD-609 Code: | e3 |
| Length: | 6.85 mm |
| Moisture Sensitivity Level: | 1 |
| Number of Functions: | 1 |
| Number of Terminals: | 32 |
| Operating Temperature-Max: | 105 °C |
| Operating Temperature-Min: | -55 °C |
| Package Body Material: | CERAMIC, METAL-SEALED COFIRED |
| Package Code: | FBGA |
| Package Equivalence Code: | BGA32,7X7,32 |
| Package Shape: | SQUARE |
| Package Style: | GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Cel): | 225 |
| Power Supplies: | 6 V |
| Seated Height-Max: | 3.8 mm |
| Subcategory: | Other Analog ICs |
| Supply Voltage-Max (Vsup): | 6.25 V |
| Supply Voltage-Min (Vsup): | 5.75 V |
| Supply Voltage-Nom (Vsup): | 6 V |
| Surface Mount: | YES |
| Technology: | BIMOS |
| Temperature Grade: | OTHER |
| Terminal Finish: | MATTE TIN |
| Terminal Form: | BALL |
| Terminal Pitch: | 0.8 mm |
| Terminal Position: | BOTTOM |
| [email protected] Reflow Temperature-Max (s): | NOT SPECIFIED |
| Width: | 6.85 mm |
|
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