| Part number: | XCZU4EV-L2SFVC784E |
| Description: | 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EV Series 252 I/O |
| Manufacturer | Xilinx Inc. |
| Encapsulation | - |
| Quantity | 8174 |
| RoHS | YES |
| TYPE | DESCRIPTION |
| Factory Lead Time | 11 Weeks |
| Package / Case | 784-BFBGA, FCBGA |
| Supplier Device Package | 784-FCBGA (23x23) |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Series | Zynq® UltraScale+™ MPSoC EV |
| Published | 2016 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of I/O | 252 |
| Speed | 533MHz, 600MHz, 1.3GHz |
| RAM Size | 256KB |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
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