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XCV1600E-8BG560C
Part number: XCV1600E-8BG560C
Description: 1.8V V 1.7mm mm FPGAs Virtex®-E Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560
Manufacturer Xilinx Inc.
Encapsulation -
Quantity 3882
RoHS YES
TYPEDESCRIPTION
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 560-LBGA Exposed Pad, Metal
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Virtex®-E
Published 2004
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 560
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn63Pb37)
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCV1600E
Pin Count 560
JESD-30 Code S-PBGA-B560
Number of Outputs 404
Operating Supply Voltage 1.8V
Number of I/O 404
RAM Size 72kB
Clock Frequency 416MHz
Number of Inputs 404
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 34992
Total RAM Bits 589824
Number of Gates 2188742
Number of LABs/CLBs 7776
Speed Grade 8
Combinatorial Delay of a CLB-Max 0.4 ns
Number of Equivalent Gates 419904
Length 42.5mm
Height Seated (Max) 1.7mm
Width 42.5mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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