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XC7Z030-2SBG485E
Part number: XC7Z030-2SBG485E
Description: Embedded - System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 484-FBGA, FCBGA 256KB Zynq®-7000 0°C~100°C TJ 1V 0.8mm 800MHz MPU Zynq-7000 RISC 32-Bit 800MHz 1.5V/2V/2.5V 485-Pin FBGA
Manufacturer Xilinx Inc.
Encapsulation -
Quantity 0
RoHS YES
TYPEDESCRIPTION
Factory Lead Time10 Weeks
Contact PlatingCopper, Silver, Tin
MountSurface Mount
Package / Case484-FBGA, FCBGA
Number of Pins485
Operating Temperature0°C~100°C TJ
PackagingTray
Published2009
SeriesZynq®-7000
JESD-609 Codee1
Part StatusActive
Moisture Sensitivity Level (MSL)4 (72 Hours)
Number of Terminations485
ECCN CodeEAR99
Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code8542.39.00.01
SubcategoryOther Microprocessor ICs
TechnologyCMOS
Terminal PositionBOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel)NOT SPECIFIED
Supply Voltage1V
Terminal Pitch0.8mm
Frequency800MHz
[email protected] Reflow Temperature-Max (s)NOT SPECIFIED
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup)1.05V
Power Supplies11.8V
Supply Voltage-Min (Vsup)0.95V
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O130
RAM Size256KB
uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
ArchitectureMCU, FPGA
Data Bus Width32b
Core ArchitectureARM
Boundary ScanYES
RAM (words)256000
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
UV ErasableN
Height Seated (Max)2.44mm
Length19mm
RoHS StatusROHS3 Compliant
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