| Part number: | OM13496UL |
| Description: | Prototyping Boards, Fabrication Kits SURFACE MOUNT TO DIP EVALUATION |
| Manufacturer | NXP USA Inc. |
| Encapsulation | - |
| Quantity | 0 |
| RoHS | YES |
| TYPE | DESCRIPTION |
| Factory Lead Time | 16 Weeks |
| Package Accepted | QSOP, TSSOP28, XFBGA, XQFN |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Number of Positions | 16, 28 |
| Specifications | SMD to DIP |
| Quantity | 23 Pieces (4 Values - Mixed Quantities) |
| Kit Type | Adapter, Breakout Boards |
| RoHS Status | ROHS3 Compliant |
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